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The Latest Breaking News from TSMC

The socket is the motherboard, Part 2 — Intel archrival (and Nvidia's BFF) plans to build giant chips that could use kilowatts of power but they won't be as big as Cerebras trillion transistor behemoth

TSMC has announced plans to create giant system-in-packages (SiPs) based on its chip-on-wafer-on-substrate (CoWoS) packaging technology.

TechRadar

US Commerce Secretary says if China seized TSMC it would be 'absolutely devastating' to the US economy, as it buys 92% of its cutting-edge chips from the Taiwanese manufacturer

As Chinese relations with Taiwan remain strained, the US continues to reinforce the importance of chip manufacturing on home soil.

PC Gamer

AMD Hits Record High Share in x86 Desktops and Servers in Q1 2024

Coming out of the dark times that preceded the launch of AMD's Zen CPU architecture in 2017, to say that AMD has turned things around on the back of Zen would be an understatement. Ever since AMD launched its first Zen-based Ryzen and EPYC processors for client and server computers,…

AnandTech

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read the most diverse news in one place.

Chip Giant TSMC's April Revenue Jumps 60% On-year

Taiwanese chip giant TSMC said on Friday that April revenue jumped nearly 60 percent on-year, riding a huge wave of demand for the advanced semiconductors used in AI hardware.

International Business Times

China seizing TSMC would be 'devastating' for U.S. economy, Commerce Secretary says

If China captures Taiwan and TSMC, this will be a major blow for U.S.-based companies and economy, which is why U.S. invests in its own semiconductor production, says Gina Raimondo.

Tom’s Hardware

Nvidia's unannounced R100 AI GPUs reportedly coming in late 2025 — 'Vera Rubin' multi-chip designs using 3nm and CoWoS-L

Analyst Ming-Chi Kuo expects Nvidia to adopt a multi-chip design for Vera Rubin R100 and R200 GPUs. These are rumored to be the next generation data center, AI, and HPC GPUs, with a faster release cadence than previous solutions.

Tom’s Hardware

Apple Announces M4 SoC: Latest and Greatest Starts on 2024 iPad Pro

Setting things up for what is certainly to be an exciting next few months in the world of CPUs and SoCs, Apple this morning has announced their next-generation M-series chip, the M4. Introduced just over six months after the M3 and the associated 2023 Apple MacBook family, the M4 is…

AnandTech

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Samsung's archrival strikes crucial partnership with Nvidia's closest ally to deliver key next-gen memory — SK Hynix teams up with TSMC to advance HBM development but could this move encourage TSMC to become like Intel?

South Korean memory giant SK Hynix has partnered with Taiwanese chip maker TSMC to produce next-gen HBM4 memory.

TechRadar

SK Hynix Says High-end AI Memory Chips Almost Sold Out Through 2025

South Korean semiconductor giant SK Hynix said Friday its entire 2024 production of high-end memory chips was sold out and most of next year's line was gone too, reflecting the huge demand for cutting-edge AI hardware.

International Business Times

Tesla's wafer-sized Dojo processor is in production — 25 chips combined into one

Additional details about Tesla's Dojo SoW emerged at TSMC's North American Technology Symposium.

Tom’s Hardware

Samsung Foundry Update: 2nm Unveil in June, Second-Gen SF3 3nm Hits Production This Year

As part of Samsung's Q1 earnings announcement, the company has outlined some of its foundry unit's key plans for the rest of the year. The company has confirmed that it remains on track to meeting its goal of starting mass production of chips on its SF3 (3 nm-class, 2nd Generation)…

AnandTech

TSMC to build massive chips twice the size of today's largest — chips will use thousands of watts of power

TSMC preps 8x reticle size or larger interposers for gargantuan AI and HPC SiPs.

Tom’s Hardware

Chip firm founded by ex-Intel president plans massive 256-core CPU to surf AI inference wave and give Nvidia B100 a run for its money — Ampere Computing AmpereOne-3 likely to support PCIe 6.0 and DDR5 tech

The 256-core AmpereOne-3, expected next year, will challenge Nvidia's B100 on AI inference.

TechRadar

TSMC Jumps Into Silicon Photonics, Lays Out Roadmap For 12.8 Tbps COUPE On-Package Interconnect

Optical connectivity – and especially silicon photonics – is expected to become a crucial technology to enable connectivity for next-generation datacenters, particularly those designed HPC applications. With ever-increasing bandwidth requirements needed to keep up with (and keep scaling out) system performance, copper signaling alone won't be enough to keep up.…

AnandTech

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PC Gamer

TSMC looks set to hit Intel where it hurts, announcing its A16 node with 'Super Power Rail' backside power delivery

The battle of the backsides. At least, that's what I'm calling it in my head.

iMore

Apple's iPhone 18 chip technology might have been announced as TSMC touts advanced 1.6nm fabrication

TSMC has announced that it is working on new chip technology for 2026, and it could debut in Apple's iPhone 18.

AnandTech

TSMC's System-on-Wafer Platform Goes 3D: CoW-SoW Stacks Up the Chips

TSMC has been offering its System-on-Wafer integration technology, InFO-SoW, since 2020. For now, only Cerebras and Tesla have developed wafer scale processor designs using it, as while they have fantastic performance and power efficiency, wafer-scale processors are extremely complex to develop and produce. But TSMC believes that not only will…

Tom’s Hardware

TSMC to go 3D with wafer-sized processors — CoW-SoW technology allows 3D stacking for the world's largest chips

TSMC plans to integrate HBM4 with system-on-wafer designs in 2027.

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iMore

M4 MacBook Pro: Everything you need to know

Apple is planning a new M4 MacBook Pro that could come out in late 2024, here's everything we know so far.

Tom’s Hardware

TSMC says it doesn't need High-NA EUV chipmaking tools for 1.6nm-class node, but Intel has championed the tech

TSMC says it will not need a high-NA litho tool for its A16 technology but will keep exploring it for A16 and beyond.

AnandTech

TSMC Preps Cheaper 4nm N4C Process For 2025, Aiming For 8.5% Cost Reduction

While the bulk of attention on TSMC is aimed at its leading-edge nodes, such as N3E and N2, loads of chips will continue to be made using more mature and proven process technologies for years to come. Which is why TSMC has continued to refine its existing nodes, including its…

Tom’s Hardware

TSMC readies lower-cost 4nm manufacturing tech: Up to 8.5% cheaper

TSMC rearchitects N4P process technology to make it cheaper.

AnandTech

TSMC 2nm Update: N2 In 2025, N2P Loses Backside Power, and NanoFlex Brings Optimal Cells

Taiwan Semiconductor Manufacturing Co. provided several important updates about its upcoming process technologies at its North American Technology Symposium 2024. At a high level, TSMC's 2 nm plans remain largely unchanged: the company is on track to start volume production of chips on it's first-generation GAAFET N2 node in the…

AnandTech

TSMC's 1.6nm Technology Announced for Late 2026: A16 with "Super Power Rail" Backside Power

With the arrival of spring comes showers, flowers, and in the technology industry, TSMC's annual technology symposium series. With customers spread all around the world, the Taiwanese pure play foundry has adopted an interesting strategy for updating its customers on its fab plans, holding a series of symposiums from Silicon…

Tom’s Hardware

TSMCs 2nm nodes get NanoFlex, N2P loses backside power delivery

TSMC's 2nm is on track for mass production in H2 2025, but there is a catch with N2P.

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