Die shots of Huawei's HiSilicon Ascend 910 chip for AI produced by TSMC and its sibling Ascend 910B, allegedly manufactured by SMIC, reveal that while the chips have many similarities, they exhibit significant differences. The 910B features fewer cores. Kurnalsalts has published die shots of Huawei's HiSilicon Ascend 910, Ascend 910B, and a currently unknown Ascend 610 for AI applications.
The die shots depict the compute chiplets of the Ascend 910 and Ascend 910B, as these chips utilize a multi-chiplet architecture. For example, Huawei's HiSilicon Ascend 910 consists of a Virtuvian AI processor, a Nimbus V3 I/O die, four HBM2E memory stacks and two dummy dies for uniformity.
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