TSMC is set to start mass production of semiconductors using its N2 (2nm-class) fabrication process sometime in the second half of next year and right now the company is doing its best to polish off the technology in terms of lowering variability and defect density and therefore improving yields. As one of TSMC employees said recently, the team has managed to increase yields of test chips by 6%, 'creating billions in savings' for the company's customers.
The TSMC employee, who calls himself Dr. Kim, did not reveal whether the foundry improved yields of SRAM test chips or logic test chips. Keeping in mind that TSMC will only start offering its shuttle test wafer services for 2nm technology in January, it is unlikely that the contract chipmaker will improve yields for prototypes of actual chips that will eventually be made at 2nm.
