New e-mails from Huawei engineers regarding Linux kernel development suggest that HiSilicon - Huawei's chip subsidiary - is prepping a new Kunpeng SoC with HBM (High Bandwidth Memory) technology - as highlighted by Phoronix. This will likely be the the first significant release from HiSilicon in a while but don't get your hopes up as it could also just be a rebranded older model with a slight pinch of HBM.
There are very few CPUs with HBM. Most notably Intel’s Xeon Max (Sapphire Rapids HBM) and AMD’s custom EPYC CPUs for Microsoft are the first ones to come to mind. Therefore, it’s a significant achievement for Huawei to put out a Kunpeng chip with HBM.
