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The Latest Breaking News from TSMC

ASML to Ship Multiple High-NA Tools in 2025, Expands Production Capacities

ASML began to ship its first High-NA lithography tool to Intel late last year ,and the machine will be fully assembled in Oregon in the coming months. Shipping only a single extreme ultraviolet (EUV) system with a 0.55 numerical aperture lens may not seem like too impressive, but the company…

AnandTech

Samsung may help Qualcomm with next-gen 2nm chip

Qualcomm has reportedly contacted Samsung about creating a prototype AP using its new 2nm process.

Android Central

GPU leaker is claiming RDNA 4 engineering samples are boosting between 3 and 3.3GHz. Remember when AMD said that about RNDA 3?

Pepperidge Farm does and I'm sure you do as well.

PC Gamer

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OpenAI’s Sam Altman seeking trillions to fund chips for AI, report says

Altman has discussed ‘wildly ambitious’ plans with investors, including the United Arab Emirates government, WSJ says.

Al Jazeera

OpenAI Chief Looking To Raise Trillions To Reshape Semiconductor Sector: WSJ

OpenAI chief Sam Altman is seeking to raise trillions of dollars to reshape the global semiconductor industry, and has held talks with potential investors including the UAE government, the Wall Street Journal reported Thursday.

International Business Times

Nvidia Blackwell: What we expect and what we want to see from Nvidia's next-gen GeForce GPUs

Rumour and speculation is running riot for Nvidia's next generation of GPUs, so here's everything we hope and expect from Nvidia's next graphics cards.

PC Gamer

TSMC to Build Second Fab in Japan: 6nm and 7nm Coming to Japan

Taiwan Semiconductor Manufacturing Co. on Tuesday formally announced plans to build a second fab in Japan. The fab will be run by Japan Advanced Semiconductor Manufacturing (JASM), a majority-owned TSMC subsidiary, and will make chips on 6 nm and 7 nm-class process technologies, which will make it the most advanced…

AnandTech

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Pixel Fold 2's rumored jump to the Tensor G4 could push its launch back

The Pixel Fold has been rumored to offer a jump in its Tensor chip and could offer users more memory.

Android Central

China chipmaker SMIC on track to produce sanctions-busting 5nm processors for Huawei this year: Report

SMIC to produce 5nm AI and smartphone system-on-chips for Huawei's HiSilicon this year, claims Financial Times.

Tom’s Hardware

China Focused on Expanding Chip Production Amid US Restrictions

China is determined to increase chip production despite US restrictions, according to the Financial Times. Despite challenges, China aims to assert itself ...

Top News

Chipmakers stumble as AMD's forecast disappoints

Learn about the recent downfall of high-flying chipmaker AMD stocks, as their forecast falls short of expectations. Find out the reasons behind the decline...

Tom’s Hardware

OpenAI CEO Sam Altman will be at Intel's next foundry event — and he's currently looking for chip partners

OpenAI's Sam Altman will talk about the importance of advanced chips for AI workloads at Intel's upcoming Direct Connect event in Feb.

Android Central

Sam Altman tours Samsung chip factory leaving us wondering what he's up to

As OpenAI CEO Sam Altman explores making in-house AI processors, he received an unusual tour of Samsung's fabrication plants.

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PC Gamer

AMD Ryzen 7 8700G review

1080p gaming with integrated graphics. For real.

Tom’s Hardware

Nvidia CEO Jensen Huang meets with TSMC in Taiwan, discusses AI chip shortage concerns over dinner

Nvidia founder Jensen Huang travels to Taiwan to have dinner with TSMC and discuss ongoing AI chip manufacturing concerns, as well as a humorous sidenote on his dancing ability.

PC Gamer

Intel Battlemage: What can we expect to see with the second generation of Arc GPUs?

Picking through the rumours and leaks to get the best view of what Intel has planned for its graphics cards.

AnandTech

Intel's First High-Volume Foveros Packaging Facility, Fab 9, Starts Operations

Intel this week has started production at Fab 9, the company's latest and most advanced chip packaging plant. Joining Intel's growing collection of facilities in New Mexico, Fab 9 is tasked with packaging chips using Intel's Foveros technology, which is currently used to build the company's latest client Core Ultra…

Tom’s Hardware

Huawei's MatePad Pro hides an unknown Kirin 9000W

Huawei MatePad 13.2-inch tablet uses unknown HiSilicon Kirin 9000W processor.

iMore

Apple first in line to get revolutionary new chip process for its iPhone and Mac lineup— First 2nm TSMC chips to go to the tech giant, but not in time for iPhone 16

Apple is first in line to benefit from the new 2nm chip process from TSMC, suggesting that future devices will get a significant bump in power.

Tom’s Hardware

ASML triples order bookings in Q4 2023 thanks to demand for EUV tools

Driven by pre-orders for advanced wafer fab equipment, ASML's orders bookings increased to $10 billion in Q4 2023.

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