Samsung is set to tape out its first HBM4 memory devices later this year with sampling set to begin in early 2025, reports nN Elec citing industry sources. The company is projected to use its latest-generation 10nm-class DRAM fabrication process to make HBM4 DRAM devices as well as its 4nm-class logic technology to produce HBM4 base dies, the report says.
After Samsung tapes out its first HBM4 memory devices and base dies, its memory and logic fabs will have to produce and assemble them, which will take a couple of months or more. After that, Samsung will test these HBM4 stacks internally and then will start sampling them with its major customers, which in the case of HBM4 means leading producers of AI and HPC processors. Samsung declined to comment on its HBM4 timeline. Samsung may start mass production of HBM4 by late 2025, though it remains to be seen when actual products using the technology emerge.
