TSMC was ahead of Intel with the adoption of EUV lithography tools for mass production, but when it comes to High-NA EUV systems, it looks like the company is behind its American rival. While Intel is already using its ASML High-NA EUV machine for R&D purposes, intending to use High-NA EUV lithography in the next two or three years, TSMC will only begin installation of its first High-NA EUV tool for R&D later this month, according to reports by DigiTimes and United Daily News.
TSMC's first ASML Twinscan EXE:5000, a High-NA lithography system designed specifically for R&D purposes, is set to be installed at TSMC's global research and development center in Hsinchu, Taiwan. The world's No. 1 contract chipmaker will begin to receive components of the machine later this month. It is going to take TSMC several months to assemble and calibrate the tool before it will be able to test the next-generation semiconductor production technology at its R&D facility in Taiwan.
