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The Latest Breaking News from TSMC

Fujitsu flaunts massive 144-core Monaka Arm chip — 2nm and 5nm chiplets, 3D-stacked CPU cores over memory

Fujitsu's Monaka is a monstrous processor with four 2nm compute chiplets, 5nm SRAM, and a massive 5nm IO die. This time, without HBM memory.

Tom’s Hardware

TSMC founder says Intel has neither a strategy nor a CEO

Founder of TSMC criticizes Intel for not developing a sophisticated strategy for AI and instead focusing on becoming a foundry

Tom’s Hardware

TSMC posts strong year-on-year revenue growth of 34% despite month-to-month slowdown — foundry pulls in $8.5B in revenue for November 2024

TSMC's strong performance is largely driven by the rapid growth and investment in artificial intelligence infrastructure.

Tom’s Hardware

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Qualcomm vs. Taiwan Semiconductor: Which Is the Better Chip Stock to Buy?

Both semiconductor companies reported robust growth in the most recent quarter, but one of them is the better buy for the long haul.

Barchart

Gelsinger fires back at recent stories about 18A's poor yields, schools social media commenters on defect densities and yields

Ex-Intel CEO Gelsinger is 'very proud of the TD/18A team for the incredible work and progress they are making'

Tom’s Hardware

The iPhone 18 lineup could feature a next-generation chipset but come with a higher price tag

Apple is reportedly considering switching to 2nm chipsets with the iPhone 18 series, which are significantly more expensive than 3nm chipsets so a price hike for consumers seems possible.

TechRadar

iPhone 18 Pro tipped for big price hike in 2026 — here's why

Apple is believed to be making the switch to 2nm chipsets for the iPhone 18 series and that means an increased cost for consumers.

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Broadcom unveils gigantic 3.5D XDSiP platform for AI XPUs — 6000mm² of stacked silicon with 12 HBM modules

Broadcom's 3.5D XDSiP platform for high-performance processors uses TSMC's CoWoS and other packaging technologies to build a system-in-packages comprising 6000mm² of 3D-stacked silicon with 12 HBM modules.

Tom’s Hardware

Huawei preps new Kunpeng CPU with HBM — unannounced Kunpeng Arm server chip matches Intel and AMD's tech

HiSilicon is reportedly preparing a new Arm-based Kunpeng server chip featuring High Bandwidth Memory (HBM).

Tom’s Hardware

Behind the Scenes of Taiwan Semiconductor's Latest Options Trends

Whales with a lot of money to spend have taken a noticeably bearish stance on Taiwan Semiconductor.

Benzinga

Remember Intel's ex-CEO saying he'd 'bet the whole company' on 18A? A South Korean outlet says the yields are just 10%, although Intel says otherwise

If I make dinner and only 10% is edible, I consider myself to be in trouble.

PC Gamer

NVIDIA’s Blackwell Chips Set for Arizona Manufacturing by TSMC?

NVIDIA is in talks to bring Blackwell production to the US, potentially reducing risks and increasing capacity for the in-demand chipset.

MarketBeat

What's Going On With Broadcom Stock On Thursday?

Broadcom launched the 3.5D XDSiP platform for efficient, low-power AI computing with industry-leading 3.5D F2F XPU technology and collaboration with TSMC and EDA partners.

Benzinga

Intel's interim CEO suggests Gelsinger's replacement should have chip fabrication experience, giving a glimmer of hope that Intel foundry could remain

Could it be ride or die for Intel's chip fabrication?

PC Gamer

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Tom’s Hardware

TSMC is reportedly in talks with Nvidia to make Blackwell GPUs in Arizona — Blackwell silicon needs to be shipped back to Taiwan for assembly

If TSMC reaches a deal with Nvidia, it could reportedly produce Nvidia's Blackwell GPUs at its Fab 21 in Arizona.

Tom’s Hardware

Jobs eviscerated at Chinese Arm chip design firm in wake of restrictions from TSMC — lack of access to 7nm node could cause 150 employees to be laid off

Half of Hongjun Microelectronics Technology’s 300 workers might be fired after the server CPU firm lost access to TSMC’s 7nm node.

PC Gamer

Intel CEO Pat Gelsinger is gone but will Intel's chip fabs follow him out the door?

If AMD is the ultimate case study, kiss goodbye to Intel's fabs.

PC Gamer

I'm going to build my very own multi-billion dollar chip fab at home with this awesome Lego kit

Anyone got a friend who works at ASML...?

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Tom’s Hardware

TSMC's N2 process has a major advantage over Intel's 18A: SRAM density

The SRAM cell size of Intel's 18A cannot match that of TSMC N2, but can TSMC's technology match 18A performance and power?

Tom’s Hardware

Intel announces the Arc B580 and Arc B570 GPUs priced at $249 and $219 — Battlemage brings much-needed competition to the budget graphics card market

Intel officially announced its first two budget-mainstream Battlemage GPUs today, the Arc B580 and Arc B570. Priced aggressively at $249 and $219, respectively, the new architecture offers performance and efficiency improvements that should give Nvidia some much-needed competition. Intel also talked about XeSS 2, with frame generation and low latency…

Tom’s Hardware

TSMC engineer boasts of recent 6% boost to 2nm yields, passing 'billions in savings' to customers

Improving TSMC's N2 yield by 6% could save billions for its customers, says employee.

Fortune

Intel's CFO has a tough new job: Serve as co-CEO to keep its finances from further 'deteriorating'

Michelle Johnston Holthaus will also act as interim co-CEO following Pat Gelsinger's departure.

Android Central

Qualcomm's next flagship SoC could see a 'significant' price hike

A report alleges that Qualcomm's next flagship chip could get even pricier.

Fortune

Intel’s CEO had big plans for a turnaround. It failed, and now he’s gone

The company has missed out on the AI boom, and shares plunged more than 60% during Pat Gelsinger’s tenure.

International Business Times UK

Quick Facts About Pat Gelsinger: Leadership Stint at Intel, Net Worth, Continued Struggle With Rivals

Gelsinger, who boasts a 40-year career spanning roles in the technology sector, departed the company amidst continued struggles of the US-based chip maker.

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