Huawei has filed a patent for a quad-chiplet design that may be used for its next-generation AI accelerator known as the Ascend 910D. Huawei's quad-chiplet design certainly mimics Nvidia's approach for its quad-chiplet Rubin Ultra, but there is one more interesting thing in that patent around Huawei's plans for its advanced chip packaging — it appears that Huawei is developing techniques that could rival market-leader TSMC's advanced packaging tech. This could eventually enable the company to sidestep US sanctions and catch up to Nvidia's AI GPU performance more quickly.
That detail is, of course, in the patent that describes how a quad-chiplet processor could be made. While we cannot say for sure that it is the Ascend 910D, we can certainly connect some dots and make an assumption about the possible part (even though the patent, of course, does not indicate that). It also aligns with current chip industry insider chatter that suggests a quad-chiplet 910D is in the works.
