The Latest Breaking News from Tom’s Hardware

New benchmarks suggest that the 5500X3D offers respectable performance in productivity workloads.

Researchers at imec and Ghent University have stacked 120 ultra-thin layers of silicon and silicon-germanium, a key step toward 3D DRAM. Using advanced epitaxial techniques, they controlled atomic strain to create a nanoscale “skyscraper” of memory, paving the way for denser, faster chips.

Japan is investing over $750 million in FugakuNEXT, a zetta-scale supercomputer built by RIKEN and Fujitsu. Powered by FUJITSU-MONAKA3 CPUs and advanced accelerators, the system will integrate AI into scientific research, aiming to achieve performance 1,000× beyond current models.

Samsung 850 Pro SSDs may be old, but they’re still quite helpful in storing your Steam games and other easily replaceable data.

Kioxia has prototyped a 5 TB flash module that delivers 64 GB/s over PCIe 6.0, utilizing a daisy-chain controller design and PAM4 signaling to scale bandwidth efficiently. While latency still lags behind DRAM, the breakthrough positions NAND as near-memory storage for AI and data-intensive workloads.

A city in central Japan is considering regulating smartphone use to improve the health of its citizens.

Nvidia is still waiting for approval from the U.S. government to sell the B30 chip to China.

Despite soaring demand for server chips, AMD’s EPYC 9005 and Intel’s Xeon 6 CPUs are selling at U.S. retailers for up to 50% below their official list prices.

The Snapmaker U1 raised $7.4 million, surpassing the Bambu Lab X1C record.