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The Latest Breaking News from SK Hynix

TSMC: Importance of Open Innovation Platform Is Growing, Collaboration Needed for Next-Gen Chips

This year TSMC is commemorating 15 years of its Open Innovation Platform, a multi-faceted program that brings together the foundry's suppliers, partners, and customers to help TSMC's customers better build innovative chips in an efficient and timely manner. The OIP program has grown over the years and now involves tens…

AnandTech

Micron to Ship HBM3E Memory to NVIDIA in Early 2024

Micron has reaffirmed plans to start shipments of its HBM3E memory in high volume in early 2024, while also revealing that NVIDIA is one of its primary customers for the new RAM. Meanwhile, the company stressed that its new product has been received with great interest by the industry at…

AnandTech

Will U.S.-China Tech Squabbles Threaten Tech Stocks?

Several mega-cap technology stocks and suppliers to Apple (AAPL ) tumbled last week after the Chinese government banned iPhones from government-backed agencies and state companies, thereby threatening iPhone sales. Also, suppliers to Huawei Technologies came under pressure last week, with some U.S. lawmakers calling for a halt to all U.S....

Barchart

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Nvidia Could Use Samsung's GDDR7 Chips for GeForce RTX 50-Series

Nvidia is reportedly evaluating Samsung's GDDR7 chips with its next-generation GPUs.

Tom’s Hardware

SK Hynix Samples 9 GT/s HBM3E: Up to 1.15 TB/s per Stack

SK Hynix's 9 GT/s HBM3E set to arrive during the first half of 2024.

Tom’s Hardware

Samsung to Produce 300-Layer V-NAND in 2024: Report

Samsung to use double-stack architecture for 300-layer 3D V-NAND memory, according to a leak.

Tom’s Hardware

Here’s the chip that could make 100TB SSDs mainstream in 2024 but you won’t be able to use them

SK Hynix demos 321-layer 4D NAND at Flash Memory Summit just weeks after 238-layer parts went in mass production.

TechRadar

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AI Boom Sees Memory Makers Ramp Up HBM Memory Production: Report

Bit shipments of HBM memory set to grow by 105% by 2024, TrendForce claims.

Tom’s Hardware

SK Hynix Demonstrates 321-Layer TLC NAND Memory

SK Hynix aims to produce 321-layer TLC NAND in 1H 2025.

Tom’s Hardware

SK Hynix Sees DRAM Market Recovery Due to AI Servers

SK Hynix says demand for HBM and DDR5 memory drives revenue growth.

Tom’s Hardware

Micron's New HBM3 Gen2 is World's Fastest at 1.2 TB/s, Teases Next-Gen at 2 TB/s+

Micron announced that its HBM3 Gen2 memory, which is the Fastest, densest and most power efficient yet, is now sampling to its partners.

Tom’s Hardware

SK Hynix Enters Portable SSD Market With Beetle X31

SK Hynix enters the consumer external SSD fray with the Beetle X31 which is cased in aluminum and offers good sustained performance.

Tom’s Hardware

SK Hynix 48 GB SODIMMs Hit Retail in China

SK hynix 48 GB DDR5 SODIMM modules hit Taobao in China, with the modules priced at about $165.

Tom’s Hardware

Nvidia Reportedly Interested in Using SK Hynix HBM3E Memory

SK Hynix to supply HBM3E samples to Nvidia for evaluation.

Tom’s Hardware

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Tom’s Hardware

U.S. to Let Samsung, SK Hynix, TSMC Expand Fabs in China: Report

U.S. set to allow South Korean and Taiwanese companies to upgrade fab operations in China using American wafer fab tools.

Tom’s Hardware

SK hynix Starts Mass Production of Speedy, 238-Layer NAND

The new memory promises speeds of up to 2,400 MT/s, which is necessary for the fastest SSDs.

Tom’s Hardware

SK Hynix Preps HBM3E Memory: A 25% Speed Boost Over HBM3

SK Hynix readies 8 GT/s HBM3e memory for AI and HPC applications.

Al Jazeera

China bars operators from buying chips from US tech firm Micron

China bans US chipmaker Micron days after the G7 members launched veiled criticism of China’s trade practices.

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The Guardian - UK

Micron shares drop after China bars its chips; UK house asking prices jump – as it happened

Micron products will be banned from key infrastructure projects in China due to ‘serious network security risks’

Tom’s Hardware

SK Hynix May Sell Yet-to-Be Completed Chinese Fab: Report

Market uncertainties and possible problems with U.S. authorities are making SK Hynix rethink its China strategy. Being unable to equip its upcoming fab in China, SK Hynix is now mulling selling off the building before moving tools in.

France 24

Memory chips dominate South Korean president's visit to US

As South Korean President Yoon Suk-yeol heads to Washington for a visit, the Financial Times is reporting that the White House has asked Seoul to urge its chipmakers (Samsung Electronics and SK Hynix) not to fill the China shortfalls of US rival Micron in the event of a ban by…

Tom’s Hardware

SK Hynix Samples 24GB HBM3 Modules: Up to 819 GB/s

SK Hynix's new 12-layer HBM3 modules to enable extreme performance and capacity.

Tom’s Hardware

G.Skill Trident Z5 RGB DDR5-7200 C34 Review: Bringing That A-Die Flavor

The market is filled with A-die memory kits now. Can G.Skill's Trident Z5 RGB memory outshine the competition?

Tom’s Hardware

U.S. CHIPS Funding Terms Will Severely Restrict Chinese Chips Industry

U.S. CHIPS Act funding requirements to limit Chinese semiconductor investments for 10 years.

Barchart

A Cut in Chip Production by Samsung Electronics May Ease Supply Glut

Samsung Electronics, the world’s largest maker of memory chips, announced last Friday that it would cut memory chip production after it reported Q1 profit that was the smallest in 14 years. South Korea’s largest company had previously resisted cutting production in an attempt to gain market share from rivals SK...

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