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Tom’s Hardware
Tom’s Hardware
Technology
Anton Shilov

SK hynix and TetraMem collaborate on experimental chip to bolster energy efficiency for edge AI devices — memristor-based in-memory SoC research leaves performance questions up in the air

SK Hynix's 16-layer HBM3E chip is seen at the SK AI Summit in Seoul .

SK hynix, TetraMem, and researchers from the University of Southern California have developed a memristor-based in-memory computing (IMC) system-on-chip (SoC) for AI edge devices. The device is designed to accelerate neural network inference in lightweight AI models while consuming a fraction of the power that higher-end GPUs or NPUs would. To a large degree, the SoC is a proof-of-concept chip, as its performance would peak at around 2.54 TOPS in a theoretical best-case scenario, which is 16X below Microsoft's Copilot+ requirements.

A DWC-optimized IMC architecture

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