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The Latest Breaking News from JEDEC

AMD EXPO ULL shows middling performance gains in initial tests despite eye-watering price increase — first benchmarks show up to a 4% improvement with DDR5-6000 CL36

The first independent benchmarks for AMD's EXPO ULL memory are available, showing just up to a 4% improvement despite an increase in price.

Tom’s Hardware

JEDEC releases new SPHBM4 standard to slash AI memory costs — Narrow 512-bit interface enables dropping expensive interposers for organic substrates

SPHBM4 promises HBM4-class bandwidth without usage of silicon interposer and CoWoS-like packaging.

Tom’s Hardware

AMD says new EXPO ‘Ultra Low Latency’ DDR5 memory should be 'effectively the same price' as current kits — feature will work on existing chipsets, but will require new DIMMs

AMD provides us with a bit more detail about its upcoming EXPO Ultra Low Latency mode, which should be available from leading memory partners soon.

Tom’s Hardware

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AMD promises 13% uplift with new EXPO ‘Ultra Low Latency’ overclocking on DDR5 DIMMs — automatic memory overclocking delivers 4% improvement over standard EXPO, says AMD

AMD’s upcoming EXPO ‘Ultra Low Latency’ automatic memory overclocking promises a 13% improvement over standard DDR5 speeds, as well as a 4% jump compared to standard EXPO.

Tom’s Hardware

Team Group agrees to $1.1 million DRAM settlement in another false advertising lawsuit — claimed advertised memory speeds required BIOS tweaks and overclocking settings

Team Group denies all wrongdoing but has agreed to settle the lawsuit involving advertised RAM performance and overclocking-related settings.

Tom’s Hardware

SK hynix introduces turbocharged LPDDR6, 33% faster and 20% more power efficient than LPDDR5X — 16Gb chips deliver 10.7 Gbps, uses 10nm node

SK Hynix has announced the successful development of its first LPDDR6 memory modules that operate at "over" 10.7Gbps. The new modules take advantage of the manufacturer's bleeding-edge 10nm-class (1c) process node.

Tom’s Hardware

New 'serial' tech will significantly reduce the cost of memory — HBM memory, that is, the sort of RAM only AI hyperscalers can use, but hey, at least they won't go after consumer RAM, or would they?

SPHBM4 uses serialization and organic substrates to lower HBM packaging costs while keeping bandwidth memory exclusive to hyperscale AI systems.

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Industry preps new 'cheap' HBM4 memory spec with narrow interface, but it isn't a GDDR killer — JEDEC's new SPHBM4 spec weds HBM4 performance and lower costs to enable higher capacity

JEDEC is nearing completion of SPHBM4, a standard that enables full HBM4 bandwidth over a 512-bit interface using a 4:1 serialization, reusing standard HBM DRAM dies and a base die. The tech promises to enable a 2.5D integration on organic substrates to support up to 64 GB per stack and…

Tom’s Hardware

Nvidia's homegrown memory design is almost standardized and ready for everyone to use — JEDEC says SOCAMM2 compact DRAM module for AI servers boasts higher speeds and broader compatibility

JEDEC is finalizing the design of the SOCAMM2 physical interface, which boasts LPDDR5X support of up to 9600 MT/s. It also features an SPD profile, making it compatible with hardware manufacturers beyond Nvidia.

Tom’s Hardware

Your next smartphone could have SSD-class storage as JEDEC UFS 5.0 specification plans for speeds approaching 11GB/s, faster than PCIe 4.0 SSDs - and yes, it's all because of AI

UFS 5.0 introduces SSD-class performance to smartphones, enabling faster AI data processing while raising questions about the everyday benefits for users.

TechRadar

Micron takes the HBM lead with fastest ever HBM4 memory with a 2.8TB/s bandwidth - putting it ahead of Samsung and SK Hynix

Micron announces industry leading HBM4 with 2.8TB/s bandwidth and 11Gbps pin speeds, claiming performance advantage over Samsung and SK Hynix.

TechRadar

AMD's memory patent outlining a 'new, improved RAM' made from DDR5 memory isn't a new development — HB-DIMMs already superseded, probably won't come to market

AMD's HB-DIMM concept probably isn't coming to market, as the company has already thrown its support behind the similar JEDEC MRDIMM standard.

Tom’s Hardware

Nvidia's revolutionary memory format for AI GPUs could come to other platforms, rivaling LPDDR6 on the horizon

Nvidia shifts from SOCAMM 1 to SOCAMM 2, targeting faster AI memory performance, broader suppliers, and possible JEDEC standardization efforts.

TechRadar

Nvidia wants 10Gbps HBM4 to blunt AMD’s MI450, report claims — company said to be pushing suppliers for more bandwidth

Nvidia is reportedly pressing its memory vendors to push beyond JEDEC’s official HBM4 baseline, reportedly requesting 10Gb/s-per-pin stacks for its 2026 Vera Rubin platform.

Tom’s Hardware

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Tom’s Hardware

Corsair lost a lawsuit over advertising XMP memory speeds, and you could get paid — the settlement covers U.S. purchases between 2018 and 2025 for overclocked kits

The gap between memory speed marketing and JEDEC reality landed Corsair in a class-action lawsuit back in 2022—one that is currently accepting applications for payouts from the settlement.

Tom’s Hardware

SK hynix completes development of next-gen HBM4 — 2,048-bit interface and 10 GT/s speeds promised for next-gen AI accelerators

SK hynix has finalized development of its HBM4 memory stacks with a 2,048-bit interface and 10 GT/s speed, 25% above JEDEC specs.

PC Gamer

Asus says its Intel 800-series motherboards are approved to run DDR5-7200 without an XMP profile, pointing to a RAM speed boost for an Arrow Lake refresh

Truth be told, I think we'd just prefer to have Nova Lake instead, thanks.

Tom’s Hardware

China introduces up to 2TB 'Mini SSD' that's 3X faster than the microSD Express used in the Switch 2, but smaller — tiny '1517' SSD is just 15x17mm and boasts impressive performance claims

3,700 MB/s sequential read and 3,400 MB/s sequential write speed in a tiny package that fits in your device like a SIM card.

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PC Gamer

AMD's new AM6 socket has all the pins—2,100 of 'em—but don't worry, your old CPU cooler will apparently still fit just fine

Plenty of pins and all the bandwidth.

TechRadar

LPDDR6 likely to debut in 2026 as JEDEC publishes new standard document and targets mobile devices and AI - desktop PCs and workstations will have to wait

Next-generation LPDDR6 memory targets power efficiency and high speed in portable systems.

Tom’s Hardware

JEDEC publishes first LPDDR6 standard — new interface promises double the effective bandwidth of current gen

LPDDR6 offers 10,6667 to 14,400 MT/s, while having better power efficiency and reliability.

Tom’s Hardware

JEDEC finalizes HBM4 memory standard with major bandwidth and efficiency upgrades

HBM4 offers faster data rates, more channels, and higher memory capacities, with features like Directed Refresh and flexible voltage options to boost performance and reliability.

TechRadar

Understanding the differences between enterprise and client SSDs

Solid State Drives have replaced HDDs, particularly in enterprise environments, but they come in different classes.

TechRadar

What is AMD EXPO? The RAM technology explained in 2025

TechRadar explains AMD EXPO, the company's RAM overclocking technology in detail

TechRadar

What is XMP? The Intel RAM technology explained

TechRadar explains XMP, Intel's RAM technology, how it works, and if you should use it in 2025

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