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The Latest Breaking News from IMEC

Surprising biomedical application found for ASML’s chipmaking EUV lithography machines — they can mass produce nanopores for molecular sensing

IMEC has successfully demonstrated the full wafer-scale fabrication of nanopores using ASML’s state-of-the-art extreme ultraviolet (EUV) machines.

Tom’s Hardware

Intel details progress on fabbing 2D transistors a few atoms thick in standard high volume fab production environment — chipmaker outlines 300-mm fab compatible with integration of 2D transistor contacts and gate stacks

Intel and imec demonstrate the first 300-mm, fab-compatible integration of contacts and gate stacks for 2D transistors, marking a critical step in turning long-studied 2D materials from lab experiments into a realistic future option for high-volume logic manufacturing.

Tom’s Hardware

HBM-on-GPU set to power the next revolution in AI accelerators - and just to confirm, there's no way this will come to your video card anytime soon

Imec’s 3D HBM-on-GPU study demonstrates extreme density potential for AI accelerators while highlighting severe thermal and performance challenges.

TechRadar

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Elon Musk says building his own 'TeraFab' chip fab may be the only answer to Tesla's colossal AI semiconductor demand — Nvidia CEO Jensen Huang warns against 'extremely hard' challenge

Elon Musk said Tesla may need to build its own massive “TeraFab” chip plant to secure enough AI processors, a move that would make Tesla one of the world’s largest chipmakers, but experts like Nvidia’s Jensen Huang warn that creating a modern semiconductor process and fab is vastly more complex…

Tom’s Hardware

Donald Trump’s vision for Gaza’s future: what a leaked plan tells us about US regional strategy

Entire neighbourhoods in Gaza lie in ruins. Hundreds of thousands are crammed into tents, struggling for food, water and power. Despite this devastation, a leaked 38-page document from Donald Trump’s administration – the Gaza Reconstitution, Economic Acceleration and Transformation (Great) Trust – proposes to “fundamentally transform Gaza” folding it into…

The Conversation

Next-generation 3D DRAM approaches reality as scientists achieve 120-layer stack using advanced deposition techniques

Researchers at imec and Ghent University have stacked 120 ultra-thin layers of silicon and silicon-germanium, a key step toward 3D DRAM. Using advanced epitaxial techniques, they controlled atomic strain to create a nanoscale “skyscraper” of memory, paving the way for denser, faster chips.

Tom’s Hardware

Few questions on Gaza, fewer on media access: Inside Indian media’s Israel junket

Last Friday, Indian readers woke up to a curious headline: Benjamin Netanyahu – accused of war crimes and facing corruption charges — offering to advise Indian counterpart Narendra Modi on dealing with the United States.

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IMEC: Can the ambitious trade corridor from India to Europe succeed?

Here are the threats, challenges, and opportunities for the ambitious India–EU connectivity plan, which for now remains only on paper.

Euronews

Moore's law isn't dead — it's just buried under six feet of silicon spin

Silicon wafer sizing isn't what you think. Yes, 3-nanometer and 2-nanometer chips sound incredibly tiny. But semiconductor process node technology names are really just marketing at this point.

Laptop

New chip industry roadmap predicts true 10 nm silicon won't arrive until 2039 and yet Moore's Law is, actually, alive and kicking

Except, of course, it won't really be 0.2 nm or anything even close to that.

PC Gamer

Apple explores using generative AI to design its chips — executive says 'it can be a huge productivity boost'

Apple Vice President for Hardware Technologies Johny Srouji says AI in EDA tools could allow it to do 'more design work in less time'.

Tom’s Hardware

Imec's next-gen high-speed chip transistor addresses manufacturing concerns — outer wall forksheet design simplifies production, but may sacrifice density

Imec has introduced a more manufacturable version of its forksheet transistor, named the outer wall forksheet, intended to extend gate-all-around (GAA) technology through the A10 node and serve as a stepping stone toward future CFET designs.

Tom’s Hardware

New India-to-Europe 'spice route' gains traction amid global tensions

Hampered by the Israel-Hamas war in Gaza, the India-Middle East-Europe Economic Corridor (IMEC) project is gaining momentum with the return of US President Donald Trump to office and the trade war between Washington and Beijing.

Euronews

‘It’s beautiful, don’t you think?’ The urban miners unearthing treasure in Belgium’s homes and garages

As the historic town of Leuven strives to become carbon neutral, it is transforming how its building are made – and demolished. Are there lessons for the rest of the world?

The Guardian - UK

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Tom’s Hardware

ASML teams up with Imec for sub-2nm process technologies with High-NA EUV chipmaking tools

ASML to install its High-NA EUV lithography tools in Imec's pilot production line to give research and development personnel access to leading-edge equipment.

Dynamite News

India, EU hold bilateral cluster meeting, discuss connectivity, IMEC, security

India and the EU held a bilateral cluster meeting in New Delhi on Friday and discussions focused on connectivity, IMEC, green and clean energy, mobility and talent, security, Meditteranean and the expansion of the European Union. Read further on Dynamite News:

TechRadar

'Like a field plowed prior to planting': Researchers want to grow lasers, yes lasers, on material commonly found in sand

Researchers at Imec have found a way to grow lasers directly on silicon, a material commonly found in sand.

International Business Times

Macron Courts Modi In Quest For Geopolitical 'Independence'

French President Emmanuel Macron and Indian Prime Minister Narendra Modi visited southern France with a packed schedule on Wednesday, fostering a relationship that Paris sees as an alternative to great power rivalries.

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Al Jazeera

Taiwan struggles to reconcile climate ambitions and chip manufacturing

The island’s semiconductor industry represents one-quarter of GDP but is a major source of carbon emissions.

Tom’s Hardware

Intel looks beyond silicon, outlines breakthroughs in atomically-thin 2D transistors, chip packaging, and interconnects at IEDM 2024

Today, the Intel Foundry Technology Research team announced technology breakthroughs in transistor, interconnects, and packaging technology, among others, which it will unveil in seven of its own papers, along with two more papers in collaboration with industry partners like imec, at the IEEE International Electron Devices Meeting (IEDM) 2024 conference.

Cycling News

Predictive nutrition and mathematic modelling - How AI is changing the WorldTour peloton

How much has machine learning infiltrated the professional peloton and where does its future lie? Cyclingnews investigates…

Tom’s Hardware

TSMC, IBM, and Samsung to present their next-gen CFET transistor innovations at an event in December

IBM, IMEC, Samsung, and TSMC to showcase their CFET research results this December.

StockNews.com

Can ASML Holdings Continue to Dominate the Semiconductor Market?

ASML Holding (ASML) reported mixed financial results in the second quarter of 2024. The company’s long-term outlook appears bright with strategic investment in capacity expansion and new technology; however, it faces decelerating sales growth and industry uncertainties. So, should you buy or hold this chip stock? Read more to find…

AnandTech

Imec Successfully Demonstrates High-NA Lithography for Logic and DRAM Patterning for First Time

Imec and ASML have announced that the two companies have printed the first logic and DRAM patterns using ASML's experimental Twinscan EXE:5000 EUV lithography tool, the industry's first High-NA EUV scanner. The lithography system achieved resolution that is good enough for 1.4nm-class process technology with just one exposure, which confirms…

Tom’s Hardware

Imec patterns first logic and DRAM transistors using High-NA litho tools

ASML and Imec successfully demonstrate high-resolution patterning using High-NA EUV tools.

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