
- 3D HBM-on-GPU design reaches record compute density for demanding AI workloads
- Peak GPU temperatures exceeded 140°C without thermal mitigation strategies
- Halving the GPU clock rate reduced temperatures but slowed AI training by 28%
Imec presented an examination of a 3D HBM-on-GPU design aimed at increasing compute density for demanding AI workloads at the 2025 IEEE International Electron Devices Meeting (IEDM).