Rapidus, Japan’s homegrown challenger to Taiwan Semiconductor Manufacturing Company (TSMC), has announced that it will start building its next-generation 1.4-nanometer fab in fiscal year 2027, with production expected to commence in Hokkaido in 2029. According to Nikkei Asia, this move is expected to help the Japanese chipmaker close the gap with the Taiwanese chip-making giant, which has already revealed its 1.4-nm technology earlier this year. The company also said that it will begin full-scale research and development on the node starting next year.
The company is backed by several Japanese companies, including giants such as Toyota and Sony, as well as private financing institutions. Aside from this, the Japanese government has also invested heavily in the startup through subsidies and direct fiscal support. Rapidus has already received a commitment of JPY 1.7 trillion, or more than US$10 billion, with several hundred billion Yen expected to be infused into the company in the coming months.
