China is striving to develop its own high-bandwidth memory-like (HBM-like) for artificial intelligence and high-performance computing applications, according to a report from the South China Morning Post. ChangXin Memory Technologies (CXMT) is reportedly at the forefront of this initiative.
HBM is the indisputable leader when it comes to performance as every HBM stack features a 1024-bit memory interface and a decent data transfer rate. Because of the wide interface and vertical stacking, production of HBM devices does not require the most advanced lithography. In fact, it is believed that global DRAM leaders use time-proven technologies for their HBM2E and HBM3 memory devices.
