The Latest Breaking News from TSMC

At its European Technology Symposium last week TSMC revealed some of the details about its Global Gigafab Manufacturing program, the company's strategy to replicate its manufacturing processes across its multiple gigafab sites. The need for large-scale multi-national fabs to have a process in place to replicate their facilities is well-documented…

Last week Taiwan Semiconductor, a large semiconductor fabrication company, said its April revenue spiked. Call options in TSM stock are having unusual activity today, underlining its underlying value.

Customer demand for AI and HPC processors is driving a much greater use of advanced packaging technologies, particularly TSMC's chip-on-wafer-on-substrate (CoWoS) services. As things stand, TSMC is just barely meeting the current demand for this packaging method – never mind future demand – which is why last year the company…

ASML and TSMC have added kill switches to advanced EUV lithography machines to prevent them from falling into the wrong hands.

TSMC can barely meet demand for AI processors, as they need larger interposers.

Rumors of Apple developing its own AI servers seem much more feasible using TSMC's 2-nanometer fabrication process.

A new report claims Apple COO Jeff Williams has visited Taiwan to help Apple secure vital 2nm chip supply.

Windows on ARM typically makes for lightweight devices with long battery life and stellar reliability. But what exactly is ARM anyway?

Although TSMC can't claim to be the first fab to use extreme UV (EUV) lithography – that title goes to Samsung – they do get to claim to be the largest. As a result, the company has developed significant experience with EUV over the years, allowing TSMC to refine how…