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The Latest Breaking News from TSMC

TSMC to Expand CoWoS Capacity by 60% Yearly Through 2026

Customer demand for AI and HPC processors is driving a much greater use of advanced packaging technologies, particularly TSMC's chip-on-wafer-on-substrate (CoWoS) services. As things stand, TSMC is just barely meeting the current demand for this packaging method – never mind future demand – which is why last year the company…

AnandTech

TSMC’s EUV machines are equipped with a remote self-destruct in case of an invasion

ASML and TSMC have added kill switches to advanced EUV lithography machines to prevent them from falling into the wrong hands.

Tom’s Hardware

TSMC struggles to meet demand for CoWoS packaging, holding back AI and HPC chip production: report

TSMC can barely meet demand for AI processors, as they need larger interposers.

Tom’s Hardware

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Apple COO Reportedly attends secret meetings with TSMC to reserve first batch of 2-nanometer production

Rumors of Apple developing its own AI servers seem much more feasible using TSMC's 2-nanometer fabrication process.

Tom’s Hardware

iPhone 17's major processor upgrade one step closer — top Apple exec visits Taiwan to secure vital 2nm supply

A new report claims Apple COO Jeff Williams has visited Taiwan to help Apple secure vital 2nm chip supply.

iMore

Windows on ARM FAQ: What it is, how ARM processors differ from CPUs, ARM history, and more

Windows on ARM typically makes for lightweight devices with long battery life and stellar reliability. But what exactly is ARM anyway?

Windows Central

TSMC Outlines Path to EUV Success: More Tools, More Wafers, & Best Pellicles In Industry

Although TSMC can't claim to be the first fab to use extreme UV (EUV) lithography – that title goes to Samsung – they do get to claim to be the largest. As a result, the company has developed significant experience with EUV over the years, allowing TSMC to refine how…

AnandTech

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New AMD Zen 6 rumors suggest a super small yet efficient TSMC 2nm process and 2026 release date

Prominent hardware leaker Moore's Law is Dead's alleged insider source has some new information about AMD Zen 6.

TechRadar

Taiwan Shifts Focus To US Amid China Tensions

Taiwan shifts focus from China to U.S., strengthening economic ties and diversifying investments amidst escalating tensions.

Top News

Rapidus 'Last Opportunity' To Put Japan Back On Global Chip Map

Japan's Rapidus project that brings together some of the world's biggest companies is the "last opportunity" to put the country's once-dominant semiconductor sector back on the global map, its chairman warned.

International Business Times

Taiwan is selling more to the US than China in major shift away from Beijing

Taiwan is reducing its reliance on the Chinese mainland as it seeks to insulate itself from pressure from Beijing and forge closer economic and trade ties with the United States

The Independent UK

TSMC to Expand Specialty Capacity by 50%, Introduce 4nm N4e Low-Power Node

With all the new fabs being built in Germany and Japan, as well as the expansion of production capacity in China, TSMC is planning to extend its production capacity for specialty technologies by 50% by 2027. As disclosed by the company during its European Technology Symposium this week, TSMC expects…

AnandTech

Ampere announces 256-core 3nm CPU, unveils partnership with Qualcomm

Ampere plans to launch 256-core AmpereOne processors at 3nm next year.

Tom’s Hardware

TSMC's third generation 3nm node on track — N3P mass production to begin later this year

TSMC will start mass producing chips on its N3P node this year as the N3E fabrication process ramps. This will be the third generation of "3nm" class nodes from the company.

Tom’s Hardware

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Tom’s Hardware

TSMC to build base dies for HBM4 memory on its 12nm and 5nm nodes

TSMC to use 12FFC+ and N5 process technologies to build base dies for HBM4.

Tom’s Hardware

Truck driver dies after ‘explosion’ at TSMC Arizona

A truck driver has died after an accident at a TSMC plant in north Phoenix. 41-year-old Cesar Anguiano-Guitron was rushed to hospital after a high-pressure waste tank valve ‘explosion’ knocked him over 20ft from his truck but updated reports say he passed away.

AnandTech

TSMC Readies Next-Gen HBM4 Base Dies, Built on 12nm and 5nm Nodes

Of the several major changes coming with HBM4 memory, one of the most immediate is the sheer width of the memory interface. With the fourth-generation memory standard moving from an already wide 1024-bit interface to a ultra-wide 2048-bit interface, HBM4 memory stacks won't be business as usual; chip manufacturers are…

AnandTech

TSMC: Performance-Optimized 3nm N3P Process on Track for Mass Production This Year

As part of the second leg of TSMC's spring technology symposium series, the company offered an update on the state of its 3nm-class processes, both current and future. Building on the back of their current-generation N3E process, the optical shrink of this process technology, N3P, is now on track to…

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TechRadar

Samsung's fiercest rival unveils mobile storage chip that will make phones and laptops faster — SK Hynix claims that its ZUFS tech will boost local AI inference without consuming more resources

Samsung's chief rival SK Hynix has developed a next-generation mobile NAND called ZUFS 4.0.

Tom’s Hardware

US to increase tariffs on Chinese semiconductors by 100% in 2025 — officials say it protects the $53 billion spent on the CHIPS Act

The U.S. will increase import tariffs on Chinese semiconductors from 25% to 50% in 2025.

TechRadar

Nvidia and MediaTek could be cooking up a powerful laptop CPU to blow away Snapdragon X Elite – or even Apple’s M4

The purported chip will apparently be made on the same advanced process as Apple’s M4 CPU.

Laptop

Nvidia might be working on new AI GPUs — but there's a catch, gamers

Nvidia is reportedly underway on a future generation of AI-focused GPUs, codenamed Rubin, but who are they really for?

StockNews.com

3 Chip Stocks to Spark Your Portfolio

The semiconductor industry’s growth prospects look promising thanks to the soaring chip demand across various end-use sectors and the rising penetration of AI, IoT devices, and machine learning. Therefore, it could be wise to buy quality chip stocks, KLA (KLAC), Taiwan Semiconductor Manufacturing (TSM), and Everspin Technologies (MRAM) to spark…

TechRadar

The socket is the motherboard, Part 2 — Intel archrival (and Nvidia's BFF) plans to build giant chips that could use kilowatts of power but they won't be as big as Cerebras trillion transistor behemoth

TSMC has announced plans to create giant system-in-packages (SiPs) based on its chip-on-wafer-on-substrate (CoWoS) packaging technology.

PC Gamer

US Commerce Secretary says if China seized TSMC it would be 'absolutely devastating' to the US economy, as it buys 92% of its cutting-edge chips from the Taiwanese manufacturer

As Chinese relations with Taiwan remain strained, the US continues to reinforce the importance of chip manufacturing on home soil.

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