The Latest Breaking News from TSMC

Xiaomi is about to launch its own smartphone chip later this month.

TSMC plans to build or ramp up nine new production facilities in 2025 — the highest in its history — as it accelerates global expansion to meet demand and rising manufacturing complexity.

Taiwanese manufacturer GlobalWafers is planning to invest $4 billion more into US-based chip manufacturing after opening a new facility in Sherman, Texas.

While scrapping the AI Diffusion Rule, the U.S. government has banned Huawei's Ascend AI processors as they allegedly use American technologies without authorization.

During a conversation at the J.P. Morgan's Global Technology, Media, and Communications conference in Boston, Intel's CFO David Zinsner confirmed that Intel doesn't have a significant volume of external chips. At least on the 18A process node but things should change with 14A.

That all-important 18A node has yet to convince the likes of Nvidia or AMD to jump onboard.

Inside one of South Korea's oldest semiconductor research institutes, the cleanrooms and workshops are calm and immaculate, but outside the Seoul National University campus, a chip storm is brewing.

2D transistor offering 40% faster speeds and lower energy use may soon disrupt the global chip market - if China can successfully scale production.

New details allege AMD's next-generation Zen 6 dense CCDs will carry up to 32 cores and 128MB of L3 cache, with 12 cores and 48MB for the standard CCDs.

Lenovo is reportedly working on a custom in-house SoC for its Yoga Pad Pro family, rumored to be built on TSMC's 5nm process.

A former SK Hynix employee has been charged with stealing wafer bonding and image sensor technologies to secure a job at Huawei’s HiSilicon, raising alarm over tech IP leaks to China.