Taiwan's TSMC is exploring the possibility of building an advanced packaging facility in Japan, reports Reuters. The company is about to begin chip production in the island nation, so building an advanced packaging facility is a natural move from TSMC. And if the company proceeds with the plan, it will significantly bolster Japan's semiconductor industry revival efforts.
TSMC is considering the introduction of its chip-on-wafer-on-substrate-series (CoWoS) packaging technology to Japan, the report says. This advanced technology is used to build high-performance processors, such as Apple's M2 Ultra for desktop workstations, AMD's Instinct MI-300 processor for AI and HPC, as well as Nvidia's H100 GPU for artificial intelligence and high-performance computing. At present, TSMC's entire CoWoS capacity is based in Taiwan, but it looks like that could change, with additional CoWoS capacity in Japan as well.
