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Tom’s Hardware
Tom’s Hardware
Technology
Hassam Nasir

Thermal pads with in-built vapor-chambers claim 50 to 80 times better thermal conductivity than normal thermal pads — 1,200 W/m-K "Vapor-Pad" from Xerendipity designed to replace traditional TIM in a CPU

Xerendipity Vapor-Pad.

Conventional thermal pads are used to cool all sorts of ICs across a number of devices, including phones. While the power envelope of our doomscrolling machines is nowhere near that of a computer, they still need effective management. In recent years, manufacturers have started to implement vapor chambers to improve thermal performance, and Xerendipity is now aiming to innovate in this space by combining both approaches into a single solution called the “Vapor-Pad.”

According to SemiAccurate, which was on the showfloor at MWC 2026, Xerendipity calls this a "VC + Thermal Pad Hybrid," and it has a pretty simple mission statement. Thermal pads are cheap and convenient, but they don't have nearly as much conductivity as vapor chambers, which are custom-built for each device. Vapor chambers can be very efficient, but they're costlier and require more R&D to get right.

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