Although Samsung Foundry was the first contract fab to formally start mass production of chips on a 3 nm-class process, so far, the company's latest process has largely been relegated to producing tiny cryptocurrency mining chips. But it looks like things will start picking up for Samsung's foundry business soon, as this week it was announced that the company has landed a more substantial order which will see the Samsung make a server-grade system-in-package (SiP) with HBM memory for an unknown client.
Per this week's press releases, Samsung Foundry is set to produce a server-grade processor with HBM memory that is set to be designed by ADTechnology, a contract chip developer from South Korea, for an American company. For now, details on the chip are light, so all we know about the 3 nm-based datacenter product is that it will will use 2.5D packaging in conjunction with HBM memory. All of which points to a high-end system-on-chip (SoC) – or rather a system-in-package (SiP).
