Nvidia is boosting orders for advanced packaging services at TSMC due to increasing demand for its compute GPUs aimed at AI applications, reports DigiTimes. Nvidia appears to be so optimistic about demand for its compute GPUs with CoWoS (chip on wafer on substrate) packaging, that it placed additional orders for the whole year.
TSMC reportedly committed to process an additional 10,000 CoWoS wafers for Nvidia throughout 2023 to support growing demand for its widely used AI chips. The report estimates that this means an extra 1,000 to 2,000 wafers each month for the remaining part of the year. The story does not reveal which compute GPUs Nvidia plans to increase production of, but at present the company has A100, A30, H100, and China-specific A800 and H800 GPUs in its line-up.
