Micron this month announced a renewed U.S. buildout strategy that expands investment plans to $150 million, plans to build an HBM packaging facility in Virginia, and invest some $50 billion in R&D. Micron's first new U.S. fab in years will begin operations in the second half of 2027, the company revealed this month.
Following the enactment of the CHIPS and Science Act in August 2022, Micron unveiled major plans to build new fabs worth over $115 billion in Idaho and New York with the aim of building 40% of its DRAM products in the U.S. over the next decade. Under the new plan, Micron projects investing $200 billion in U.S.-based memory production and R&D over the next 20+ years, with support from the U.S. government.
The effort includes $150 billion for manufacturing and $50 billion for R&D, with the goal of creating around 90,000 direct and indirect jobs. The new plan envisions two leading-edge DRAM fabs in Idaho, a site with four fabs in New York, and an HBM packaging facility in Virginia. Let's take a closer look at Micron's plans.
