Today, the Intel Foundry Technology Research team announced technology breakthroughs in 2D transistor technology using beyond-silicon materials, chip interconnects, and packaging technology, among others. The company will unveil its research in seven of its own papers, along with two more papers in collaboration with industry partners like imec, at the IEEE International Electron Devices Meeting (IEDM) 2024 conference.
Intel’s disclosures include new research that enhances gate-all-around (GAA) transistor scaling and performance both with silicon and with atomically-thin 2D transistors that use beyond-silicon materials. Intel also outlined its subtractive Ruthenium technology that improves interconnect performance and scalability, ultimately enabling smaller wires between transistors, and a chip packaging breakthrough that improves chip-to-chip assembly throughput by 100x.
