Intel Corporation (INTC) celebrated the opening of Fab 9, its cutting-edge factory in Rio Rancho, New Mexico on January 24, marking a milestone for high-volume manufacturing of 3D advanced packaging technologies.
This facility, the company's first high-volume semiconductor center, is the sole U.S. factory that fabricates the world's most sophisticated packaging solutions on a large scale. Intel's network of factories worldwide forms a competitive edge, facilitating product enhancement and efficiency.
