Audio manufacturer FiiO is better known as a producer of digital audio players, DACs and desktop headphone amplifiers, but the established Chinese company is set to branch out into the world of headphones with its inaugural pair of over-ear, open-back headphones.
The new FT3 model will feature 60mm dynamic drivers within an aluminium alloy shell, a beryllium-plated gasket and a diamond-like carbon (DLC) diaphragm. The gasket promises to reduce distortion thanks to its lightweight beryllium composition, while FiiO claims the DLC’s sturdy, lightweight design will give the FT3 a “wide soundstage with excellent separation and detail”.
