Element Six (E6), a company owned by the De Beers Group known for its diamond mines, launched a copper-plated diamond composite material designed to improve cooling efficiency. According to E6, this new solution is meant for applications such as artificial intelligence (AI), high-performance computers (HPC), and GaN RF devices, all producing a lot of heat.
“Thermal management for semiconductor devices remains a significant challenge as power levels increase and packaging continues to advance, “says E6 Chief Technologies Daniel Twitchen. “Our copper diamond composite addresses these challenges by offering a scalable and affordable solution for next-generation AI and HPC devices. This innovation empowers our customers to enhance performance and reliability, while reducing cooling costs.”
