Applied Materials has unveiled three new chipmaking tools that define what the company calls the 'angstrom era' of chipmaking, signaling a transition toward next-generation process technologies sometimes controlled at the level of individual atoms. The new systems — Kinex, Xtera, and PROVision 10 — are designed to enable next-generation fabrication methods while also improving performance efficiency and yields of logic and memory semiconductor production nodes and packaging technologies today.
"As chips become more complex, Applied is focused on driving materials engineering breakthroughs to provide the performance and power-efficiency improvements needed to scale AI," said Dr. Prabu Raja, President of the Semiconductor Products Group at Applied Materials. "We are collaborating earlier and deeper with our customers to co-develop solutions that accelerate chipmaker roadmaps and enable major device inflections in logic, memory and advanced packaging."
