PARIS and SEOUL, South Korea, June 3, 2026 /PRNewswire/ -- Air Liquide has signed a major long-term contract with SK hynix, a global leader in memory semiconductors. The Group will bring its pioneering solutions to SK hynix's massive industrial project dedicated to advanced packaging of HBM (High-Bandwidth Memory), the backbone of the global AI revolution. The investment of nearly 200 million euros is a first success following the acquisition of DIG Airgas earlier this year, significantly strengthening its leadership in both the region and the Electronics industry.
In order to supply SK hynix's new packaging and testing fab "P&T7", located in Cheongju, in the Chungcheongbuk province, Air Liquide will build and operate a state-of-the-art nitrogen production unit. Set to begin operations in late 2027, the facility will supply high-purity gases and high-purity compressed air to the fab in charge of the advanced packaging of HBM chips, a key component of AI development.
