Following Huawei and Lenovo's lead in developing self-developed silicon within China, Xiaomi is working on its own XRing 01 SoC. This new chip reportedly features standard Arm Cortex cores and a 3nm-grade process node from TSMC. Per HXL, the XRing 01 carries a beefy decacore configuration, and based on now-delisted Geekbench tests of the chip, shared by leaker Jukanlosreve, Xiaomi's alternative appears to be delivering performance comparable to MediaTek's flagship Dimensity 9400 SoC.
Faced with significant restrictions from the U.S. and motivated by potential cost savings compared to alternatives like Qualcomm and MediaTek, Chinese manufacturers are rapidly transitioning towards in-house chip design and manufacturing. Huawei takes this a step further as its latest Kirin X90 SoCs for the Matebook Pro 2025 family is believed to feature custom Arm-based 'Taishan' cores and is reportedly fabbed in China using SMIC's 7nm process.
