According to a Bloomberg report, Amkor Technology, one of the world's largests outsourced semiconductor assembly and test (OSAT) providers, has inked a preliminary agreement with the U.S. government to receive funding for its new advanced chip packaging and test facility in Peoria, Arizona. The facility will cost $2 billion and will be located close to TSMC's upcoming Fab 21 complex in Arizona to support customers making chips there.
Amkor's new facility near Peoria, Arizona, its first domestic packaging site, will be the largest of its kind in the United States. The company has secured 55 acres of land for the campus, which will include over 500,000 square feet (46,451 square meters) of cleanroom space when fully built and equipped. To give a sense of scale, this cleanroom area will be more than twice the size of the cleanroom space at Amkor's advanced chip packaging facility in Vietnam.
