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Tom’s Hardware
Tom’s Hardware
Technology
Anton Shilov

TSMC to build massive chips twice the size of today's largest — chips will use thousands of watts of power

Broadcom.

Thought AMD's Instinct MI300X and Nvidia's B200 GPUs were huge? Think again: TSMC is working on a version of its chip-on-wafer-on-substrate (CoWoS) packaging technology that will enable system-in-packages (SiPs) over two times bigger, the company announced at its North American Technology Symposium. These will use 120x120mm monstrous packages and will draw kilowatts of power, the foundry envisions. 

(Image credit: TSMC)
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