
Thought AMD's Instinct MI300X and Nvidia's B200 GPUs were huge? Think again: TSMC is working on a version of its chip-on-wafer-on-substrate (CoWoS) packaging technology that will enable system-in-packages (SiPs) over two times bigger, the company announced at its North American Technology Symposium. These will use 120x120mm monstrous packages and will draw kilowatts of power, the foundry envisions.
