This year TSMC is commemorating 15 years of its Open Innovation Platform, a multi-faceted program that brings together the foundry's suppliers, partners, and customers to help TSMC's customers better build innovative chips in an efficient and timely manner. The OIP program has grown over the years and now involves tens of companies and over 70,000 IP solutions for a variety of applications. It continues to grow, and its importance will get higher than ever when next generation technologies, such as 2 nm, and advanced packaging methods become mainstream in the coming years.
"This is not a marketing program, it is actually an engineering program to enable the industry," said Dan Kochpatcharin, Head of Design Infrastructure Management at TSMC, at the OIP 2023 conference in Amsterdam, the Netherlands. "We have a huge engineering team behind to work with the EDA partners, IP partners, and design partners."
