A slide that TSMC has demonstrated at its European OIP forum clarifies the advantages that its A14 (1.4nm-class, front side power delivery) fabrication process, due in 2028, will offer compared to the direct predecessor. As it turns out, A14 will offer 16% more performance at the same power and complexity, and 27% lower power at the same clocks and complexity compared to N2 (2nm-class, front side power delivery). Yet, to extract the full potential of next-generation manufacturing technologies, chip designers might need to use smarter electronic design automation (EDA) tools.
