TSMC is mulling upgrading the capabilities of its yet-to-be-built Fab 23 phase 2 in Japan in a bid to make chips on its N4 process technology (4nm-class) there, according to Nikkei. Advancing fab capabilities is hardly something unexpected for foundries like TSMC, as they tend to follow demand with their offerings. What is perhaps more surprising is that TSMC has removed heavy machinery equipment from the site and has notified suppliers that it would not need new fab tools in Japan throughout the whole 2026.
TSMC's Fab 23 phase 2 (aka JASM phase 2) near Kumamoto, Japan, was projected to make chips on N6 (6nm-class) and N7 (7nm-class) fabrication technologies, which would complement the capabilities of the company's Fab 23 phase 1 that processes wafers using 40nm, 28nm, 22nm, 16nm, and 12nm-class manufacturing processors. If the information from Nikkei is correct, then Fab 21 phase 2 will also add N4 and N5 capabilities to its list to make more advanced chips for Japanese customers.
