AI data centers will start using xMEMS Labs’ tiny, all-silicon, active fan-on-a-chip cooling solution, µCooling, initially designed for smartphones and mobile devices.
According to GamesBeat, this technology will be deployed in small high-performance optical transceiver DSPs with a maximum TDP of 18W or higher. The tiny cooling chip can deliver up to 5 watts of localized cooling, and its small size and lack of moving parts mean it can be reliably deployed in hard-to-reach places and require no maintenance at all.
