Taiwan Semiconductor Manufacturing Co. (NYSE:TSM) plans to start construction on four new fabs later this year, targeting mass production of 2-nanometer chips by late 2028, according to Central Taiwan Science Park Bureau Director-General Hsu Maw-shin.
The new facilities, designated Fab 25, will house four 1.4-nanometer wafer production lines. The contract chipmaker aims to complete risk assessments by 2027 and ramp up to a monthly output of 50,000 wafers, the Taipei Times reported on Sunday.
