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Tom’s Hardware
Tom’s Hardware
Technology
Kunal Khullar

SK hynix to showcase 16-layer HBM3E, 122TB enterprise SSD, LPCAMM2, and more at CES

SK Hynix CEO at the HBM3E 16-Hi Stack memory announcement.

Leading South Korean memory manufacturer SK hynix announced that it will showcase a suite of advanced memory solutions tailored for artificial intelligence (AI) applications at this year's Consumer Electronics Show (CES) in Las Vegas.

Building upon its 12-layer High Bandwidth Memory (HBM) technology, the company will display samples of its latest 16-layer HBM3E products, officially announced in November 2024. This advancement employs advanced MR-MUF processes to enhance thermal performance and mitigate chip warping, achieving industry-leading results.

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