
Leading South Korean memory manufacturer SK hynix announced that it will showcase a suite of advanced memory solutions tailored for artificial intelligence (AI) applications at this year's Consumer Electronics Show (CES) in Las Vegas.
Building upon its 12-layer High Bandwidth Memory (HBM) technology, the company will display samples of its latest 16-layer HBM3E products, officially announced in November 2024. This advancement employs advanced MR-MUF processes to enhance thermal performance and mitigate chip warping, achieving industry-leading results.