Avid readers of Tom’s Hardware have read a lot about the upcoming HBM4 and GDDR6 memory technologies, but as neither is used on mass production devices, few of us get to see actual HBM4 and GDDR6 memory packages. Good news, SK Hynix demonstrated them at CES, and our own Matt Safford has managed to grab some pictures.
SK Hynix demonstrated the industry’s first 16-Hi HBM4 memory package at the trade show, highlighting both the density that could not be achieved without its MR-MUF molding technology as well as HBM4’s 2,048-bit interface. SK hynix's HBM4 memory stacks are said to operate at 10 GT/s, which is 25% faster than the official JEDEC specification. Meanwhile, adopters like Nvidia want to have headroom for both extra performance in scale-up deployments (if customers are willing to) and for performance efficiency in hyperscaler applications.
