
At the SK AI Summit 2024, SK hynix CEO took the stage and revealed the industry's first 16-Hi HBM3E memory - beating both Samsung and Micron to the punch. With the development of HBM4 going strong, SK hynix prepared a 16-layer version of its HBM3E offerings to ensure "technological stability" and aims to offer samples as early as next year.
A few weeks ago, SK hynix unveiled a 12-Hi variant of its HBM3E memory - securing contracts from AMD (MI325X) and Nvidia (Blackwell Ultra). Raking in record profits last quarter, SK hynix is in full steam once again as the giant has just announced a 16-layer upgrade to its HBM3E lineup, boasting capacities of 48GB (3GB per individual die) per stack. This increase in density now allows AI accelerators to feature up to 384GB of HBM3E memory in an 8-stack configuration.