If anyone has been thinking that Intel was in trouble, they might want to think again, at least if reports about its order books for the next few years are anything to go by. That's because its chip-making and die-packaging services appear to have captured the interest of Apple, Broadcom, and Google for future processors and other semiconductor devices.
This is all according to a report by GF Securities HK Brokerage Ltd, with Jukan on X offering a key snippet. One particular table shows Intel's 18A-P and 14A process nodes, as well as its EMIB (Embedded Multi-die Interconnect Bridge) packaging technology, being used by Apple for a 'smartphone SoC' and a non-specified ASIC, as well as Google for a future tensor processing unit (TPU), plus several others.
