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The Economic Times
The Economic Times
Technology

Samsung Electronics wins $200 billion Broadcom AI chip partnership, boosting foundry push

Samsung Electronics said on Saturday it struck a pact with U.S. chip designer Broadcom to widen cooperation across memory chips, contract chip making and advanced packaging envisaged to exceed $200 billion until 2030.

Winning long-term production commitments from Broadcom, one of the world's leading custom AI chip designers, could boost utilisation ‌at Samsung's ⁠advanced ⁠manufacturing facilities to pull ahead in the race to supply AI chips.

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