
Rapidus has successfully begun installing ASML's Twinscan NXE:3800E EUV lithography system at its Innovative Integration for Manufacturing (IIM-1) facility in Chitose, Hokkaido, marking a significant milestone for Japan’s semiconductor industry. In 2025, the tool will be used to make prototype chips using a 2nm process technology and then for commercial semiconductor production starting in 2027.
ASML's Twinscan NXE:3800E lithography system is currently the company's most advanced lithography tool explicitly designed to produce chips at 2nm-class process technologies and beyond. The machine features ASML's latest high-power light source, a new wafer handler, faster wafer stages, and other components needed to support increased throughput, enabling the performance of over 220 wafers per hour at a 30 mJ/cm² dose.