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The Economic Times
The Economic Times
National

Paras Defence arm to set up ₹6,200 crore semiconductor packaging facility in Madhya Pradesh

Paras Defence and Space Technologies' subsidiary, Paras Semiconductors Private Limited, will invest around ₹6,200 crore to set up a greenfield advanced semiconductor packaging facility in Madhya Pradesh, the company said in a filing on Wednesday.

The company has signed a memorandum of understanding (MoU) with the Department of Science and Technology, acting through the MP State Electronics Development Corporation (MPSeDC), for the project.

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