Micron has started shipping samples of its next-generation HBM4 memory to key customers, the company announced this week. The new memory assemblies for next-generation AI and HPC processors feature a 36 GB capacity and offer bandwidth of 2 TB/s.
Micron's HBM4 first samples are 12-High devices packing 36 GB of memory and featuring a 2048-bit wide interface as well as a data transfer rate of around 7.85 GT/s. The samples rely on 24GB DRAM devices made on the company's 1ß (1-beta) DRAM process technology as well as logic base dies produced by TSMC using its 12FFC+ (2nm-class) or N5 (5nm-class) logic process technology.
