Micron was the first company to introduce 24Gb DDR5 memory devices as well as start shipping actual modules on their base last fall. As it turns out, as part of Micron's HBM3 Gen2 announcement, the company wants to maintain the lead and is prepping to mass produce 32Gb DDR5 ICs as well high-capacity memory modules in the first half of 2024, the company revealed today.
Micron's monolithic 32Gb DDR5 IC will be made on Micron's 1β (1-beta) fabrication technology, which is the company's most advanced production node and also the last fabrication process that does not use extreme ultraviolet lithography. For now, Micron has not disclosed the data transfer rates it expects from its 32Gb devices, though given the fact that these will be Micron's 3rd Generation DDR5 ICs, expect them to be reasonably fast.
