Micron has finally added advanced EUV lithography to its DRAM production nodes as its newest process node enters pilot production. Unlike its competitors, Micron was in no hurry to use EUV lithography to make DRAM, so it is the last in the industry to adopt the most advanced technology available. This year, Micron began pilot production of DRAM memory on its 1γ (1-gamma) fabrication process, which will enter high volume manufacturing (HVM) next year.
Today, Micron's memory chip production uses process technologies that rely exclusively on DUV lithography. In contrast, both Samsung and SK Hynix have invested in expensive EUV lithography tools that cost around $200 million each, ultimately reducing cost. However, Micron has developed cost- and performance-competitive DRAMs at its 1α and 1ß nodes by using standard DUV multi-patterning, but the switch to EUV will improve economics with its newer node.
