Today, Micron Technology has started constructing its multi-billion-dollar packaging facility for high-bandwidth memory (HBM) in Singapore. The company will invest $7 billion in the plant, as it expects demand for HBM3E, HBM4, and HBM4E memory to skyrocket in the coming years amid the AI boom. The facility is set to start operations in 2026.
Micron's packaging facility for high-bandwidth memory (HBM) is located next to Micron's existing fabs in Singapore that produce 3D NAND and DRAM. The new HBM assembly plant will commence production in 2026 and then plans to substantially increase its capacity in 2027. The facility will use advanced AI-driven automation to boost operational efficiency, though the company does not disclose where and how artificial intelligence will be used.
